Jinfeng Laboratory’s image sensor chip fan-out packaging service project inquiry and procurement work has now ended. The results are as follows:

1. Project name: Jinfeng Laboratory image sensor chip fan-out packaging service project

2. Project number: JF-FW-2026-D005

3. Review date: April 1, 2026

4. Announcement date: April 2, 2026 - April 3, 2026

5. Evaluation results:

The bid was rejected due to the fact that there were less than 3 bidders for this project.